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Characterising the Corrosion Properties of Flux Residues: Part 2: Test Method Modification

L.J. Turbini (Georgia Institute of Technology, City, State, USA)
J. Schodorf (Georgia Institute of Technology, City, State, USA)
J. Jachim (Georgia Institute of Technology, City, State, USA)
L. Lach (Motorola, City, State, USA)
R. Mellitz (Digital Equipment Corporation, City, State, USA)
F. Sledd (Digital Equipment Corporation, City, State, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1992

Abstract

Today's emphasis on alternative flux technology as an approach to eliminate the use of chlorofluorocarbons (CFCs) requires an understanding of the corrosion potential of the new fluxes. In 1989, Dr David Bono proposed that monitoring the effect of different soldering fluxes on the rate of corrosion of a copper wire printed on a circuit board would provide quantitative information on the corrosion potential of a flux. Further analysis of this testby Turbini et al. revealed that the degradation mechanism associated with Bono's test is the growth of conductive anodic filaments along the glass fibres of the epoxy‐glass boards. The original test method has been revised, and the test coupon redesigned with the goal of developing a standard, quantitative test method to characterise soldering fluxes. This paper will describe the equipment, test coupon and electrical circuitry associated with this proposed test method. Procedures chosen to reduce error sources associated with electrical noise will be reported and explained.

Citation

Turbini, L.J., Schodorf, J., Jachim, J., Lach, L., Mellitz, R. and Sledd, F. (1992), "Characterising the Corrosion Properties of Flux Residues: Part 2: Test Method Modification", Soldering & Surface Mount Technology, Vol. 4 No. 3, pp. 50-54. https://doi.org/10.1108/eb037802

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited