Electronic materials, particularly tin‐lead coated component leads, may degrade and acquire a poor solderability as a result of long‐term storage or prolonged periods at elevated temperatures (during burn‐in). This paper presents the results of studies on the surface chemistry and microstructure of such coatings together with a technique for stripping degraded coatings and replacing them with pristine finishes having excellent solderability.
Harris, P.G., Whitmore, M.A., Fairweather, B. and Dunn, B.D. (1992), "Stripping and Replacement of Damaged Solderable Coatings", Soldering & Surface Mount Technology, Vol. 4 No. 3, pp. 21-26. https://doi.org/10.1108/eb037799
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