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Calculation of Solder Joint Volume for TAB and MCR Components

M.J. Remmler (Philipps‐Universität Marburg, Marburg/Lahn, Germany)
A. Mödl (NCR GmbH, Augsburg, Germany)
F. Hermann (NCR GmbH, Augsburg, Germany)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1992

Abstract

This paper describes ways of simplifying the equations characterising the equilibrium shape of reflowed solder in the interconnection of TAB (Tape Automated Bonding) and MCR (Moulded Carrier Ring) components with negligible loss in accuracy. A drastic reduction of the numerical effort necessary to calculate the solder volume for fine pitch devices is achieved. The equations are applied to TAB and MCR packages which are hotbar‐soldered to a substrate. The results of these calculations are in good agreement with experimental data.

Citation

Remmler, M.J., Mödl, A. and Hermann, F. (1992), "Calculation of Solder Joint Volume for TAB and MCR Components", Soldering & Surface Mount Technology, Vol. 4 No. 2, pp. 22-25. https://doi.org/10.1108/eb037789

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited