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A Study of the Failure of Soldered SMT Joints during Thermal Cycling

J.H. Huang (University of Science and Technology, Beijing, China)
W. Gao (Beijing Institute of Technology, Beijing, China)
Y.Y. Jian (Harbin Institute of Technology, Harbin, China)
Y.H. Jiang (Harbin Institute of Technology, Harbin, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1992

Abstract

An installation has been developed for carrying out thermal cycling experiments on soldered SMT joints. Using this thermal cycle installation (which was developed by the authors) and a simulated chip carrier, study has been made of the influence of various factors on the reliability of soldered SMT joints during thermal cycling. These factors include the position of the soldered joint, the temperature range of the thermal cycle, the dwell time, etc.

Citation

Huang, J.H., Gao, W., Jian, Y.Y. and Jiang, Y.H. (1992), "A Study of the Failure of Soldered SMT Joints during Thermal Cycling", Soldering & Surface Mount Technology, Vol. 4 No. 2, pp. 7-9. https://doi.org/10.1108/eb037785

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited