In view of the increasing interest in low temperature and lead‐free solder alloys, a review was made of existing information on the physical properties of bismuth alloys suitable for electronic bonding applications, by reflow and wave soldering. A comparison was made, where possible, with existing tin‐lead alloys already in widespread use, with new information experimentally derived where none was currently available.
Nicholson, A. and Bloomfield, D. (1992), "The Use of Bismuth Alloy Systems for Reflow and Wave Soldering", Soldering & Surface Mount Technology, Vol. 4 No. 1, pp. 23-26. https://doi.org/10.1108/eb037776Download as .RIS
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