This paper presents the requirements for infra‐red soldering machines for reflow soldering of printed boards with components for surface mounting. Guidelines for controlling and adjusting the infra‐red reflow soldering process, as well as a computer model to help the user of infra‐red reflow systems to adjust an infra‐red oven, are provided. In specifying the various process conditions, the authors have considered that a careful adjustment of the process parameters will improve the soldering quality.
de Langen, M.T.W. and Verguld, M.M.F. (1990), "Technical Outline Specification and Guideline for Infra‐red Reflow Soldering", Soldering & Surface Mount Technology, Vol. 2 No. 2, pp. 32-37. https://doi.org/10.1108/eb037717Download as .RIS
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