A high density module

Aircraft Engineering and Aerospace Technology

ISSN: 0002-2667

Article publication date: 1 February 2000




(2000), "A high density module", Aircraft Engineering and Aerospace Technology, Vol. 72 No. 1. https://doi.org/10.1108/aeat.2000.12772aad.006



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

A high density module

Keywords Diehl Microelectronics, Multichip module, Radar, Defence, Aircraft

Diehl Microelectronics' new multi-chip module, which is distributed exclusively in the UK by GD Technik, has been designed for use in military, avionics, space and rugged industrial applications. According to its manufacturers, the Modular X system will form the kernel of the radar and weapons systems on future aircraft.

Modular X is said to be a high-performance, high-reliability configurable computer module that embeds high-end processor cores with support peripherals and memories inside a military specification metal/ceramic package. Modular X is constructed from a combination of substrates that are thermally matched and tested pre- and post-assembly.

Modular X claims to offer significant cost savings when compared to discrete solutions and in some instances may be used to replace board level designs utilising military semiconductor products that have been made obsolete. This flexible and modular approach is believed to add no additional redesign or qualification costs to a system. The modules are offered in a number of different temperature specifications from commercial through to MIL883. The product also claims enhanced EMI/RFI protection.

Because Modular X is a completely developed and verified computer system, hardware development time is said to be greatly reduced. Powerful test and debug tools allow extensive execution control and access to the module is gained through PC Com and JTAG BSCAN ports.

Developed test software is transferred through the com-port while JTAG testing provides in-circuit testing of the system's interconnections.

The Modular X system is available with 68020, 68040, C40 and power PC processor cores. Radhard configurations are under development. Each multi-chip module comprises the microprocessor, a peripheral processor, and an array of UARTS, tuners, parallel I/O, 1553 RT/BC and a watchdog. High density SRAM, EEPROM and Flash memories can also be added. The option to implement an FPGA is available.

Details available from: GD Technik Ltd. Tel: +44 (0) 118 934 2277; Fax: +44 (0)118 934 2896; Web site: www.gd-technik.com

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