Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 7 June 2022
Issue publication date: 6 January 2023
Abstract
Purpose
This paper aims to investigate the effect of different doses of gamma radiation on the micromechanical response (hardness properties and creep behaviour) of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder alloys.
Design/methodology/approach
SAC305 solder pastes deposited on printed circuit boards (PCBs) were subjected to a reflow soldering process to form soldered samples. The soldered samples were irradiated with a gamma source at different doses (5–50 Gy). Nanoindentation testing was used to determine the hardness properties and creep behaviour after gamma irradiation.
Findings
The results showed that the hardness of SAC305 solder alloys gradually increased up to 15 Gy and then gradually decreased to 50 Gy of gamma irradiation. The highest hardness value (0.37 GPa) was observed on SAC305 solder alloys exposed to 15 Gy irradiation. Hardening of SAC305 solder alloy was suggested to be due to the high defect density induced by the gamma irradiation. Meanwhile, exposure to 50 Gy irradiation resulted in the lowest hardness value, 0.13 GPa. The softening behaviour of SAC305 solder alloy was probably due to the evolution of defect size in the solder joint. In addition, the creep behaviour of the SAC305 solder alloys changed significantly with different gamma irradiation doses. The creep rates were higher at a dose of 10 Gy up to a dose of 50 Gy. Gamma irradiation caused the SAC305 solder alloy to become more ductile compared to the non-irradiated alloy. The stress exponent also showed different deformation mechanisms with varying gamma doses.
Originality/value
Research into the micromechanical properties of solder alloys subjected to gamma irradiation has rarely been reported, especially for Sn-Ag-Cu lead-free solder. Thus, this research provides a fundamental understanding of the micromechanical response (hardness and creep behaviour) of solder, especially lead-free solder alloy, to gamma irradiation.
Keywords
Acknowledgements
This research has been fully supported by Fundamental Research Grant Scheme, FRGS/1/2018/STG07/UPNM/02/1. The authors would like to acknowledge Ministry of Higher Education (MOHE) and National Defence University of Malaysia for the approved fund assuring this significant research viable and effective. The authors would like to thank to Universiti Kebangsaan Malaysia and RedRing Solder (M) Sdn. Bhd. for providing research materials and collaboration work.
Citation
Wan Yusoff, W.Y., Ismail, N., Mohmad Lehan, N.F.N., Amat, A., Ku Ahmad, K.Z., Jalar, A. and Abdul Rahman, I. (2023), "Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach", Soldering & Surface Mount Technology, Vol. 35 No. 1, pp. 51-58. https://doi.org/10.1108/SSMT-09-2021-0060
Publisher
:Emerald Publishing Limited
Copyright © 2022, Emerald Publishing Limited