Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 9 February 2024
Issue publication date: 20 February 2024
Abstract
Purpose
The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.
Design/methodology/approach
Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.
Findings
The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.
Originality/value
It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.
Keywords
Acknowledgements
The authors extend their appreciation to the Deanship of Scientific Research at King Khalid University for funding this work through a large group Research Project under grant Number RGP2/289/44.
Conflicts of interest: All authors declare that they have no conflicts of interest.
Citation
Shalaby, R.M. and Saad, M. (2024), "Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications", Soldering & Surface Mount Technology, Vol. 36 No. 2, pp. 111-122. https://doi.org/10.1108/SSMT-08-2023-0052
Publisher
:Emerald Publishing Limited
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