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Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Waluyo Adi Siswanto (Universitas Muhammadiyah Surakarta, Surakarta, Indonesia)
Kirill Borodin (Ural Federal University Named after the first President of Russia B. N. Yeltsin, Yekaterinburg, Russian Federation and M.N. Mikheev Institute of Metal Physics, Ural Branch, Russian Academy of Sciences, Ekaterinburg, Russian Federation)
Zaid Hamid Mahmoud (Diyala University, Diyala, Iraq)
A. Surendar (Department of Pharmacology, Saveetha Dental College and Hospital, Saveetha Institute of Medical and Technical Sciences, Chennai, India)
Sami Sajjadifar (Department of Chemistry, Payame Noor University, Tehran, Islamic Republic of Iran)
Galiya Abdilova (Shakarim State University of Semey, Semey, Kazakhstan)
Jun Chang (Central South University, Changsha, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 2021

Issue publication date: 12 July 2021




The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.


Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.


It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.

Originality value

It is confirmed.



K. Borodin was supported by the State Task no. AAAA-A19 119070890020-3 (subject Alloys) of the Ministry of Education and Science of the Russian Federation.

Retraction notice: The publishers of Soldering & Surface Mount Technology wish to retract the article “Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems” by W.A. Siswanto, K. Borodin, Z.H. Mahmoud, A. Surendar, S. Sajjadifar, G. Abdilova and J. Chang, which appeared in Volume 33, Issue 4, 2021.

Following concerns that authorship for this article was offered for sale prior to submission to Soldering & Surface Mount Technology, an investigation has shown evidence of a compromised peer review process. As a result, the findings of the article cannot be relied upon.

As part of the investigation authors were asked to provide reasonable explanations for authorship changes at revision and of authors’ contribution to the paper, neither has been provided.

Authors submitting to the journal are expected to adhere to the guidelines and policies of the journal.

The publishers of the journal sincerely apologize to the readers.


Siswanto, W.A., Borodin, K., Mahmoud, Z.H., Surendar, A., Sajjadifar, S., Abdilova, G. and Chang, J. (2021), "Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems", Soldering & Surface Mount Technology, Vol. 33 No. 4, pp. 232-239.



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