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Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

Mohamad Solehin Mohamed Sunar (Department of Manufacturing Engineering, Western Digital®, SanDisk Storage Malaysia Sdn. Bhd., Batu Kawan, Malaysia)
Maria Abu Bakar (Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Atiqah A. (Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Azman Jalar (Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Muhamed Abdul Fatah Muhamed Mukhtar (Department of Manufacturing Engineering, Western Digital®, SanDisk Storage Malaysia Sdn. Bhd., Batu Kawan, Malaysia)
Fakhrozi Che Ani (Department of Manufacturing Engineering, Western Digital®, SanDisk Storage Malaysia Sdn. Bhd., Batu Kawan, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 22 September 2023

Issue publication date: 10 January 2024

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Abstract

Purpose

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

Design/methodology/approach

The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.

Findings

The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.

Originality/value

Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

Keywords

Acknowledgements

The authors would like to acknowledge the technical support provided by Western Digital via SanDisk Storage Malaysia Sdn. Bhd. through a research grant (RR-2020-004) and collaboration activities with Universiti Kebangsaan Malaysia.

Competing interests: The authors declare no competing interests.

Citation

Mohamed Sunar, M.S., Abu Bakar, M., A., A., Jalar, A., Muhamed Mukhtar, M.A.F. and Che Ani, F. (2024), "Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing", Soldering & Surface Mount Technology, Vol. 36 No. 1, pp. 51-59. https://doi.org/10.1108/SSMT-05-2023-0025

Publisher

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Emerald Publishing Limited

Copyright © 2023, Emerald Publishing Limited

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