Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 10 August 2018
Issue publication date: 15 August 2018
Abstract
Purpose
This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys.
Design/methodology/approach
The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard.
Findings
It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated.
Originality/value
It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.
Keywords
Citation
Hasnine, M. (2018), "Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder", Soldering & Surface Mount Technology, Vol. 30 No. 4, pp. 233-240. https://doi.org/10.1108/SSMT-02-2018-0007
Publisher
:Emerald Publishing Limited
Copyright © 2018, Emerald Publishing Limited