Temperature cycling with Peltier elements of boards with SMD components and failure evaluation
Abstract
Purpose
This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.
Design/methodology/approach
The authors discuss the characteristics of the design, the threshold temperatures, dynamic properties of the system and, most importantly, the reliability and the useful life of the Peltier elements. The advantages and disadvantages of the system are mentioned as well as examples of use.
Findings
The utilisation of Peltier elements for temperature cycling is possible, but it is important to keep in mind that the reliability of the elements is similar to the reliability of the system, and therefore, it is essential to replace the defective Peltier elements during the cycling.
Research limitations/implications
The construction of system is very simply. It is necessary to ensure the Peltier elements with low dispersion parameters.
Originality/value
The system is very well suited for cycling of printed boards, especially one sided, multi-chip systems, COB systems, flip-chip embedded construction, etc. The system can be used in situations where it is possible to ensure an effective heat transfer and where extremely low temperatures are not required.
Keywords
Acknowledgements
Funding for this research work was supported through a grant project of the Czech Ministry of Education, Sport, Youth for Brno University of Technology FEKT-S-11-5/96 “Research of excellent technologies for 3D packaging and interconnection”. Financial support from Central European Institute of Technology Centre (CEITEC) CZ.1.05/1.1.00/02.0068 project is also highly acknowledged.
Citation
Šandera, J. and Nicák, M. (2014), "Temperature cycling with Peltier elements of boards with SMD components and failure evaluation", Soldering & Surface Mount Technology, Vol. 26 No. 2, pp. 53-61. https://doi.org/10.1108/SSMT-02-2013-0004
Publisher
:Emerald Group Publishing Limited
Copyright © 2014, Emerald Group Publishing Limited