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Numerical simulation of thermal and stress fields for multilayer and multi-pass weaving WAAM of magnesium alloy

Fan Zhang (School of Materials Science and Engineering, Tianjin University, Tianjin, China and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin, China)
Junqi Shen (School of Materials Science and Engineering, Tianjin University, Tianjin, China and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin, China)
Shengsun Hu (School of Materials Science and Engineering, Tianjin University, Tianjin, China and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin, China)
Hui Geng (School of Materials Science and Engineering, Tianjin University, Tianjin, China and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin, China)
Shunxing Wang (School of Materials Science and Engineering, Tianjin University, Tianjin, China and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin, China)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 8 October 2024

55

Abstract

Purpose

A 3D finite element (FE) model based on the double ellipsoidal heat source was developed to investigate the evolution of temperature and stress fields during the multilayer and multi-pass wire and arc additive manufacturing (WAAM) process. This paper aims to investigate the evolution of temperature and stress fields during the multilayer and multi-pass wire and arc additive manufacturing (WAAM) process by developing a 3D finite element (FE) model based on the double ellipsoidal heat source.

Design/methodology/approach

Experimental thermal cycle curves and residual stresses were obtained by thermocouples and X-ray diffraction, respectively. The validity of the model was verified by the corresponding experimental results.

Findings

The deposition process of the upper pass led to the partial remelting of the lower deposited pass. The thermal process of the current-deposited pass alleviated the stress concentration in the previous-formed passes. A more uniform temperature distribution could be obtained by using the reciprocating deposition path. Compared to the reciprocating deposition path, the peak values of the transverse and longitudinal tensile residual stresses of the deposited sample under the unidirectional deposition path were reduced by 15 MPa and increased by 13 MPa, respectively. The heat conduction in the deposited passes could be improved by extending the inter-pass cooling time appropriately. With an increase in the inter-pass cooling time, the longitudinal residual stress in the middle region of sample along longitudinal and transverse directions showed increase and decrease–increase trends, respectively, while the transverse residual stress exhibited decrease trend.

Originality/value

This study enhances the understanding of temperature and stress fields evolution during the multilayer and multi-pass cold metal transfer-WAAM processes of magnesium alloy and provides the reference for parameter optimization.

Keywords

Acknowledgements

The authors gratefully acknowledge the research funding by National Natural Science Foundation of China (Grant No. 52075377).

Funding: The work was supported by the National Natural Science Foundation of China (Grant No. 52075377).

Data availability: The raw/processed data required to reproduce these findings cannot be shared at this time due to technical or time limitations.

Declaration of competing interest: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Citation

Zhang, F., Shen, J., Hu, S., Geng, H. and Wang, S. (2024), "Numerical simulation of thermal and stress fields for multilayer and multi-pass weaving WAAM of magnesium alloy", Rapid Prototyping Journal, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/RPJ-01-2024-0014

Publisher

:

Emerald Publishing Limited

Copyright © 2024, Emerald Publishing Limited

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