In depth study of lead frame tape residuein quad flat non-leaded package
Microelectronics International
ISSN: 1356-5362
Article publication date: 6 September 2019
Issue publication date: 1 October 2019
Abstract
Purpose
Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it.
Design/methodology/approach
An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength.
Findings
Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape’s thermoplastic adhesive properties.
Originality/value
This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution.
Keywords
Acknowledgements
This work is supported by 20160111FRGS entitled: “Intermetallic Compound Growth Behaviour for Insulated Cu Wire in IC Packaging Under High Temperature Reliability Stress Test”. The author would like to thank Nexperia Semiconductors for the technical assistance, funding and great support.
Citation
Nadaraja, S.K. and Yap, B.K. (2019), "In depth study of lead frame tape residuein quad flat non-leaded package", Microelectronics International, Vol. 36 No. 4, pp. 129-136. https://doi.org/10.1108/MI-12-2018-0077
Publisher
:Emerald Publishing Limited
Copyright © 2019, Emerald Publishing Limited