The preparation of anisotropic conductive paste and its application in FOB interconnection

Abstract

Purpose

The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system.

Design/methodology/approach

Differential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90º peel adhesion were tested before and after high temperature and high humidity test (85°C, 85% humidity), thermal cycling (−45°C∼125°C, 30min/cycle) and pressure cooker test (PCT, 121°C, 100% humidity 2 atm) to evaluate the flex on board (FOB) interconnection reliability.

Findings

It is found that FOB test vehicles have been successfully bonded by using ACP for the first time. And the ACP bonding joint of FOB has good reliability and can meet the requirements of FOB interconnection. Compared with conventional anisotropic conductive film (ACF), this ACP interconnection provides higher adhesion strength, higher joint current carrying capability and higher reliability performance and lower cost for FOB interconnection.

Originality/value

ACP is applied in the interconnection of FOB. It has the higher reliability performance and lower cost for than the conventional ACF.

Citation

Cai, X., Zhai, A., Zhou, C. and Paik, K.-W. (2023), "The preparation of anisotropic conductive paste and its application in FOB interconnection", Microelectronics International, Vol. 40 No. 2, pp. 166-171. https://doi.org/10.1108/MI-11-2022-0187