Connection of electronic and microelectronic modules

Abstract

Purpose

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Design/methodology/approach

A newly developed system with chip or cylindrical components is presented. The article describes a practical solution of connection with 0.603 and mini-metal electrode leadless face (MELF) surface mount device (SMD) resistors.

Findings

A new method of rigid solder connection for electronic modules is presented. This system is original and patented.

Practical implications

This solution is not used yet. Testing of a new system is executed now.

Originality/value

This article shows a real and original construction with chip and cylindrical chip components.

Citation

Sandera, J. (2014), "Connection of electronic and microelectronic modules", Microelectronics International, Vol. 31 No. 2, pp. 86-89. https://doi.org/10.1108/MI-10-2013-0053