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Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging

Youxin Zhang (College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China)
Yang Liu (College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China)
Rongxing Cao (College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China)
Xianghua Zeng (College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China)
Yuxiong Xue (College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 22 September 2022

21

Abstract

Purpose

Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the transmission characteristics of high-frequency electrical signals using experimental and simulation methods.

Design/methodology/approach

This work carries out the irradiation test of the specimens and measures their S21 parameters before and after irradiation. A simulation model describing the total dose effect was built based on the experimental test results. And, the radiation hardening design is evaluated by the simulation method.

Findings

The experimental results demonstrate that the S21 curve of the interconnection decreases with the increase of the irradiation dose, indicating that the total dose effect leads to the decline of its signal transmission characteristics. According to the simulation results, decreasing the height of the through silicon via (TSV), increasing the radius of the TSV, reducing the length of Si and increasing the number of grounded through silicon via have positive effects on improving the radiation resistance of the interconnection structure.

Originality/value

This work investigates the effect of radiation on the transmission characteristics of interconnection structures for 3D packaging and proposes the hardening design methods. It is meaningful for improving the reliability of 3D packaging in space applications.

Keywords

Acknowledgements

The authors would like to thank the Postgraduate Research and Practice Innovation Program of Jiangsu Province under Grant No. SJCX21_1574.

Citation

Zhang, Y., Liu, Y., Cao, R., Zeng, X. and Xue, Y. (2022), "Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging", Microelectronics International, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/MI-07-2022-0120

Publisher

:

Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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