This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained.
Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure.
It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes.
The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test.
The authors would like to thank all colleagues at lnfineon, Malacca and Malaysia for their support.
Harun, F., Ismail, R., Jalar, A. and Abdullah, S. (2015), "Effect of wire diameter and hook location on second bond failure modes", Microelectronics International, Vol. 32 No. 1, pp. 32-36. https://doi.org/10.1108/MI-03-2014-0011
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