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Thermal performance of optimum exponential fin profiles subjected to a temperature jump

Mustafa Turkyilmazoglu (Department of Mathematics, Hacettepe University, Ankara, Turkey and Department of Medical Research, China Medical University Hospital, China Medical University, Taichung, Taiwan)

International Journal of Numerical Methods for Heat & Fluid Flow

ISSN: 0961-5539

Article publication date: 6 July 2021

Issue publication date: 20 January 2022

146

Abstract

Purpose

This paper aims to seek purely analytical results relying on the physical parameters including the temperature jump parameter.

Design/methodology/approach

The exponential fin profiles and heat transfer enhancement influenced by a temperature jump at the base are the main targets of this paper.

Findings

The introduced temperature slip at the base penetrates through the surface of the fin and reorganizes the distribution of temperature all over the surface. The overall impact of the temperature jump on the fin efficiency is such that it acts to lower the fin efficiency. However, the efficiency of the exponential fin is increasing for growing shape exponential fins as compared to the rectangular and decaying ones. Hence, exponential fins amenable to certain temperature jump has significance in technological cooling processes. Finally, the optimum dimensions regarding the base fin thickness and the fin length of the exponential profiles are assessed by means of optimizing the base heat transfer rate given a cross-sectional area.

Originality/value

Exact solutions are provided for optimum exponential type fins subjected to a temperature jump. The optimum dimensions regarding the base fin thickness and the fin length of the exponential profiles are assessed.

Keywords

Citation

Turkyilmazoglu, M. (2022), "Thermal performance of optimum exponential fin profiles subjected to a temperature jump", International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 32 No. 3, pp. 1002-1011. https://doi.org/10.1108/HFF-02-2021-0132

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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