This paper aims to develop an ideal technique for the preparation of print circuit boards (PCBs) with ladder conductive lines on practical industrial process lines.
First, the raw materials of ladder copper-clad laminates were prepared by plating double-sided copper-clad laminates with vertical plating line. Second, etching compensation experiments were designed and conducted to set up the relationships between etching compensation and width of conductive lines on ladder line print circuit boards (LLPCBs). Third, to evaluate the process technique for the preparation of LLPCBs through etching compensation, verification experiments were designed and conducted on a practical industrial process line, and the quality of lines on LLPCBs was observed and evaluated.
Under the judgment of the quality of conductive lines on LLPCBs as well as the feasibility with a practical industrial process line, the process technique for the preparation of LLPCBs with etching compensation is a simple and reliable method which has the potential to be applied in the industry.
It is the first successful report of a new method that produces LLPCBs with etching compensation and has the potential to be applied in the industry.
The authors gratefully acknowledge the support from Guangdong Province of Ministry of Education (No. 2012A090300007), the National Natural Science Foundation of China (No. 61474019) and the Funds of Large Apparatus and Equipment of Chongqing University (201406150020).
Li, X., Liu, J., Zhang, S., He, W., Chen, S., Li, Z. and Chen, J. (2015), "Study on process technique of PCBs with ladder conductive lines", Circuit World, Vol. 41 No. 1, pp. 34-40. https://doi.org/10.1108/CW-09-2014-0036
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