Temperature suppression of metal panel in electromagnetic field

Guochao Zheng (Guangdong University of Technology, Guangzhou, China)
Fuli Wang (Guangdong University of Technology, Guangzhou, China)
Baiping Yan (Guangdong University of Technology, Guangzhou, China)
Runting Cheng (Guangdong University of Technology, Guangzhou, China)

Circuit World

ISSN: 0305-6120

Publication date: 23 March 2020

Abstract

Purpose

The purpose of this study is to suppress the temperature rise of high voltage wall bushing metal plate.

Design/methodology/approach

First, the authors built a model of a traditional metal plate and got the magnetic field intensity distribution by FEA tools. Optimized according to the magnetic field intensity distribution, the authors slot the traditional metal plate and embed permanent magnets in the slot. Finally, the authors got the temperature distribution diagrams of the above three cases at different current levels by FEA tools.

Findings

Slotted metal plate is beneficial to suppress magnetic induction intensity, but the improvement of the magnetic induction intensity uniformity is not obvious. The method of embedding a permanent magnet in a slotted metal plate can optimize the magnitude and uniformity of the magnetic induction intensity in the metal plate. The larger the current passing through the metal plate, the better the temperature suppression effect of the slotted metal plate and the slotted metal plate embedded in the permanent magnet.

Originality/value

The effect of structural factors, slotting plate and setting permanent magnets on slots on the temperature of supporting plate is studied. The paper proposes two methods, slotting metal panels and embedding permanent magnet metal panels, to solve the problems of eddy current loss and high calorific value of the panel, which is of great significance to the safety of the grid equipment.

Keywords

Citation

Zheng, G., Wang, F., Yan, B. and Cheng, R. (2020), "Temperature suppression of metal panel in electromagnetic field", Circuit World, Vol. 46 No. 4, pp. 317-324. https://doi.org/10.1108/CW-07-2019-0069

Download as .RIS

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

To read the full version of this content please select one of the options below

You may be able to access this content by logging in via Shibboleth, Open Athens or with your Emerald account.
To rent this content from Deepdyve, please click the button.
If you think you should have access to this content, click the button to contact our support team.