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Dot sensitivity analysis of ferromagnetic materials for topology optimization in an axi-symmetric magnetostatic system

SeungGeon Hong (School of Electronic and Electrical Engineering, Sungkyunkwan University, Suwon, Republic of Korea)
Kang Hyouk Lee (School of Electronic and Electrical Engineering, Sungkyunkwan University, Suwon, Republic of Korea)
Il Han Park (School of Electronic and Electrical Engineering, Sungkyunkwan University, Suwon, Republic of Korea)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 29 April 2019

Issue publication date: 3 June 2019

145

Abstract

Purpose

The purpose of this paper is to propose dot sensitivity analysis of ferromagnetic materials for topology optimization in an axi-symmetric magnetostatic system.

Design/methodology/approach

The dot sensitivity formula for the axi-symmetric system is derived as a closed form using the continuum shape sensitivity formula. The dot sensitivity method is combined with the level set method to perform topology optimization.

Findings

Derived dot sensitivity analysis can generate a ferromagnetic ring torus in a vacant region. Thus, an initial design is not needed for the design material. Two design problems are tested to demonstrate the usefulness of dot sensitivity.

Originality/value

By simultaneously using the shape sensitivity and dot sensitivity, in axi-symmetric magnetic system, the design space is expanded and it includes the interface and the inside of the vacant region. This property can reduce the possibility of local optimum convergence.

Keywords

Acknowledgements

This work was supported by the Korean Ministry of Environment (No. 2018000120010).

Citation

Hong, S., Lee, K.H. and Park, I.H. (2019), "Dot sensitivity analysis of ferromagnetic materials for topology optimization in an axi-symmetric magnetostatic system", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 38 No. 3, pp. 990-998. https://doi.org/10.1108/COMPEL-10-2018-0413

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

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