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Robust optimal design of low frequency metamaterials considering the fabrication imperfections and parameter fluctuations

Yiying Li (College of Electrical Engineering, Zhejiang University, Hangzhou, China)
Dun Sun (College of Electrical Engineering, Zhejiang University, Hangzhou, China)
Shiyou Yang (College of Electrical Engineering, Zhejiang University, Hangzhou, China)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 19 May 2022

Issue publication date: 12 January 2023

38

Abstract

Purpose

The purpose of this paper is to develop a robust optimization methodology for metamaterial (MM) unit designs to minimize the effect of manufacturing and operational uncertainties.

Design/methodology/approach

A new robustness quantification function, applicable to both convex and nonconvex relationships between the mean and the standard deviation, is introduced. A distance-based local radial basis function network surrogate model is proposed to substitute the global radial basis function network to reduce the heavy computational cost without any scarification on the solution accuracy.

Findings

The optimized results of a prototype MM unit demonstrate the feasibility and merit of the proposed methodology. The proposed methodology outperforms the existing ones in both performance and robust parameters in the design of a prototype MM unit.

Originality/value

It provides a robust optimization methodology for MM units when considering the imperfections in fabrications and fluctuations in operation and environment conditions in engineering applications.

Keywords

Citation

Li, Y., Sun, D. and Yang, S. (2023), "Robust optimal design of low frequency metamaterials considering the fabrication imperfections and parameter fluctuations", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 42 No. 1, pp. 14-25. https://doi.org/10.1108/COMPEL-01-2022-0034

Publisher

:

Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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