The cyclic fatigue behaviour of ball grid arrays
Abstract
This paper describes failure load analysis to predict the number of fatigue cycles required to cause adhesion failure at the thick film conductor and alumina substrate interface in ball grid array packages (BGAs). This enables prediction of the number of fatigue cycles required to lift the thick film conductor from the alumina substrate. Adhesion strength is determined by the mechanical properties of the thick‐film ink bonding mechanisms, geometry and processing conditions. The investigation is intended to increase the understanding of the adhesion properties between the thick‐film ink and the substrate in ball grid arrays.
Keywords
Citation
Curley, A.J., Williams, K.J., Le, T. and Patel, H. (1999), "The cyclic fatigue behaviour of ball grid arrays", Microelectronics International, Vol. 16 No. 3, pp. 43-45. https://doi.org/10.1108/13565369910293341
Publisher
:MCB UP Ltd
Copyright © 1999, MCB UP Limited