Testing on dynamic behavior of PBGA assembly by considering fixed‐modes

Abstract

Purpose

The purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging and to investigate the dynamic behavior of PBGA assembly by considering fixed‐modes for design and reliability evaluation of PBGA packaging.

Design/methodology/approach

A PBGA assembly prototype with different structure and material parameters is designed and manufactured. The modal distribution under excitation cycling can be tested by hammering test. The dynamic test about the PBGA assembly prototype can be implemented with different structure characteristics, materials parameters and fixed‐modes. To illustrate the validity of experimental test, the numerical simulation for the dynamic behavior of the PBGA assembly prototype is developed by using finite element method. Comparison between the experimental results and simulation can illustrate the validity of the experimental test and finite element modeling each other.

Findings

The modal distribution test shows the influence of structure characteristics, materials parameters and fixed‐modes of PBGA assembly board. The changing trends of the dynamic modal characteristics during the dynamic excitation can be obtained with different structure characteristics, materials parameters and fixed‐modes of PBGA assembly. Test shows that the fixed location of the assembly board is the most important factor to influence the first frequency and modal deformation of the assembly board. Higher frequency and smaller deformation can be obtained when there are more constraints in printed circuit board.

Research limitations/implications

The numerical model is a compendious model by predigesting structure. The research on more accurate mathematical model of the PBGA assembly prototype is a future work.

Practical implications

It can imply the dynamics of PBGA assembly. It builds a basis for future work for design and reliability evaluation of PBGA packaging.

Originality/value

This paper provides useful information about the dynamic behavior of PBGA assembly with different structure characteristics, materials parameters and fixed‐modes.

Citation

Yang, P. and Chen, Z. (2011), "Testing on dynamic behavior of PBGA assembly by considering fixed‐modes", Microelectronics International, Vol. 28 No. 2, pp. 23-29. https://doi.org/10.1108/13565361111127313