Wire bonding using copper wire

Abstract

Purpose

This paper attempts to review recent advances in wire bonding using copper wire.

Design/methodology/approach

Dozens of journal and conference articles published recently are reviewed.

Findings

The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strain‐hardening effects, and stiff wire on weak support structures are briefly analysed. The solutions to the problems and recent findings/developments in wire bonding using copper wire are discussed.

Research limitations/implications

Because of page limitation of the paper, only a brief review is conducted. Further reading is needed for more details.

Originality/value

This paper attempts to provide introduction to recent developments and the trends in wire bonding using copper wire. With the references provided, readers may explore more deeply by reading the original articles.

Citation

Zhong, Z.W. (2009), "Wire bonding using copper wire", Microelectronics International, Vol. 26 No. 1, pp. 10-16. https://doi.org/10.1108/13565360910923115