The performance of a high‐speed chip is highly dependent on the interconnects, which connect different macro cells within a VLSI chip. Delay, power dissipation and cross‐talk are the major design constraints for high performance VLSI interconnects. The importance of on‐chip inductance is continuously increasing with higher clock frequency, faster on‐chip rise time, wider wires, ever‐growing length of interconnects and introduction of new materials for low resistance interconnects. In the current scenario, interconnect is modeled as an RLC transmission line. Interconnect width optimization plays an important role in deciding transition delay and power dissipation. This paper aims to optimize interconnect width for a matched condition to reduce power and delay parameters.
Width optimization is done for two sets of interconnect terminating conditions, namely active gate and passive capacitance. SPICE simulations have been used to validate the findings.
For a driver interconnect load model terminated by an active gate load, a trade‐off exists between short circuit and dynamic power in inductive interconnects, since with wider lines dynamic power increases, but short circuit power of the load gate decreases due to reduced transient delay. Whereas, for a line terminated by a capacitor, such trade‐off does not exist. Many of the previous researches have modeled the active gate load at the terminating end by its input parasitic gate capacitance.
This paper shows that such modeling leads to inaccuracy in estimation of power, and therefore non‐optimal width selection, especially for large fan‐out conditions.
The finding is that the impedance matching between transmission line at driver and load ends plays an important role in estimation of overall power dissipation and transition delay of a VLSI circuit.
Kaushik, B., Sarkar, S. and Agarwal, R. (2006), "Width optimization of global inductive VLSI interconnects", Microelectronics International, Vol. 23 No. 1, pp. 26-30. https://doi.org/10.1108/13565360610642723Download as .RIS
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