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Advances in microwave MCM‐D technology

Philip Pieters (IMEC, MCP/MCM‐group, Leuven, Belgium)
Walter De Raedt (IMEC, MCP/MCM‐group, Leuven, Belgium)
Eric Beyne (IMEC, MCP/MCM‐group, Leuven, Belgium)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000



The thin film multilayer multichip module technology (MCM‐D) was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the technology is more and more evolving towards use in the interconnection of RF and microwave circuits with integrated passive components. This paper gives an overview of this evolution towards microwave MCM‐D technology and the recent advances with respect to the integration of high quality passive components. With a discussion on the flip chip mounting of active devices, the link towards fully integrated high frequency front‐end systems is pointed out.



Pieters, P., De Raedt, W. and Beyne, E. (2000), "Advances in microwave MCM‐D technology", Microelectronics International, Vol. 17 No. 2, pp. 19-22.




Copyright © 2000, MCB UP Limited

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