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Hydrocarbon fluxes for ionic compound free soldering

Toshihiro Miyake (Department of Chemistry, Gifu University, Gifu, Japan Department of Production and Engineering, Denso Corporation, Kariya, Japan)
Masaru Ishida (Department of Chemistry, Gifu University, Gifu, Japan)
Satoshi Inagaki (Department of Chemistry, Gifu University, Gifu, Japan)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 25 September 2007

270

Abstract

Purpose

The purpose of this paper is to develop a new ionic compound free soldering process.

Design/methodology/approach

The ability of hydrocarbons including 9,10‐dihydroanthracene, eicosane, 2,6,10,14‐tetramethylpentadecane, cyclooctane, and dicyclopentadiene to reduce cuprous or cupric oxide was investigated. The applicability of hydrocarbons as ion free flux reagents was experimentally examined. The hydrocarbons were applied to the soldering of pre‐oxidized copper electrodes under practical conditions.

Findings

A 9,10‐dihydroanthracene was found to be efficient at reducing cuprous or cupric oxide powder under an argon atmosphere at 300°C for 2 min. The high‐reducing ability of the hydrocarbon is in agreement with the low‐homolytical C−H bond dissociation energy calculated based on the density functional theory. A 9,10‐dihydroanthracene was shown, by the highest soldering efficiency and sufficient reliability in the environmental testing, to be applicable as an ion‐free soldering flux.

Originality/value

The findings of this paper suggest a new method for an ionic compound free soldering process.

Keywords

Citation

Miyake, T., Ishida, M. and Inagaki, S. (2007), "Hydrocarbon fluxes for ionic compound free soldering", Soldering & Surface Mount Technology, Vol. 19 No. 4, pp. 11-17. https://doi.org/10.1108/09540910710848509

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited

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