Implementing lead‐free solders – the performance aspects

Abstract

Purpose

To draw attention to the need to consider design and performance, as well as production, in the implementation of lead‐free solders.

Design/methodology/approach

The potential failure modes of solder joints and their underlying causes are reviewed. A hypothetical design exercise is employed to demonstrate key requirements for reliable design.

Findings

The substantial variation in influential mechanical properties over the ranges of stress, temperature and strain rate is likely to be encountered in service. In addition to these three parameters, there is the need to consider time‐temperature profiles in the service cycle and the prior thermal history of the joint materials.

Originality/value

The demonstration that reliable design and life prediction can only be achieved by employing appropriate properties in appropriate constitutive expressions.

Citation

Plumbridge, W.J. (2006), "Implementing lead‐free solders – the performance aspects", Soldering & Surface Mount Technology, Vol. 18 No. 1, pp. 11-18. https://doi.org/10.1108/09540910610647071