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Failure analysis of lead‐free solder joints for high‐density packages

John Lau (Agilent, Santa Clara, California, USA)
Dongkai Shangguan (Flextronics, San Jose, California, USA)
Todd Castello (Flextronics, Youngsville, North Carolina, USA)
Rob Horsley (Celestica, Kidsgrove, Staffordshire, UK)
Joe Smetana (Alcatel, Plano, Texas, USA)
Nick Hoo (Tin Technology, Middlesex, UK)
Walter Dauksher (Agilent, Fort Collins, Colorado, USA)
Dave Love (Sun Microsystems, Menlo Park, California, USA)
Irv Menis (IBM, Endicott, New York, USA)
Bob Sullivan (HDPUG, Scottsdale, Arizona, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004



Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.



Lau, J., Shangguan, D., Castello, T., Horsley, R., Smetana, J., Hoo, N., Dauksher, W., Love, D., Menis, I. and Sullivan, B. (2004), "Failure analysis of lead‐free solder joints for high‐density packages", Soldering & Surface Mount Technology, Vol. 16 No. 2, pp. 69-76.



Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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