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CBGA solder joint thermal fatigue life estimation by a simple method

T.E. Wong (Raytheon Electronic Systems, El Segundo, California, USA)
C.Y. Lau (Raytheon Electronic Systems, El Segundo, California, USA)
H.S. Fenger (Raytheon Electronic Systems, El Segundo, California, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Abstract

A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic SnPb solder on both top and bottom of the ball. A closed‐form solution, based on the calculation of the equilibrium of the displacements within the electronic package assembly, was first derived in order to calculate the solder joint strains during temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution for the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials. A fatigue life prediction model was established.

Keywords

Citation

Wong, T.E., Lau, C.Y. and Fenger, H.S. (2004), "CBGA solder joint thermal fatigue life estimation by a simple method", Soldering & Surface Mount Technology, Vol. 16 No. 2, pp. 41-45. https://doi.org/10.1108/09540910410537327

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited