Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures
Abstract
Deformation studies on eutectic Sn‐Ag solder (Sn‐3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA‐III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear‐strain relationships, peak shear stress as a function of rate of simple shear‐strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.
Keywords
Citation
Rhee, H., Subramanian, K.N., Lee, A. and Lee, J.G. (2003), "Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures", Soldering & Surface Mount Technology, Vol. 15 No. 3, pp. 21-26. https://doi.org/10.1108/09540910310505080
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited