The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs
Abstract
Lead‐free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead‐containing solders. The reliability of lead‐free solders has been studied a lot recently, but knowledge of it is still incomplete and many issues related to them are under heavy debate. This paper presents results from a study of the formation of voids with regard to the number of reflow cycles in three different kinds of solder joints: first the ones prepared with lead‐free solder paste and lead‐free plastic ball grid array (PBGA) components, next the ones prepared with lead‐free solder paste and tin‐lead‐silver PBGA components, and last the ones prepared with tin‐lead solder paste and tin‐lead‐silver PBGA components.
Keywords
Citation
Nurmi, S.T., Sundelin, J.J., Ristolainen, E.O. and Lepistö, T. (2003), "The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs", Soldering & Surface Mount Technology, Vol. 15 No. 1, pp. 31-38. https://doi.org/10.1108/09540910310455707
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited