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Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders

Shi‐Wei Ricky Lee (Electronic Packaging Laboratory, Department of Mechanical Engineering, Hong Kong University of Science & Technology, Kowloon, Hong Kong)
Ben Hoi Wai Lui (Electronic Packaging Laboratory, Department of Mechanical Engineering, Hong Kong University of Science & Technology, Kowloon, Hong Kong)
Y.H. Kong (Advanced Interconnect Technologies (HK) Ltd., Tsuen Wan, N.T., Hong Kong)
Bernard Baylon (Advanced Interconnect Technologies (HK) Ltd., Tsuen Wan, N.T., Hong Kong)
Timothy Leung (Advanced Interconnect Technologies (HK) Ltd., Tsuen Wan, N.T., Hong Kong)
Pompeo Umali (Advanced Interconnect Technologies (HK) Ltd., Tsuen Wan, N.T., Hong Kong)
Hector Agtarap (Advanced Interconnect Technologies (HK) Ltd., Tsuen Wan, N.T., Hong Kong)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2002

502

Abstract

Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead‐free solder joints for various assembly conditions. A five‐leg experiment was designed which included various combinations of solder materials and peak reflow temperatures. It was found that the lead‐free solder joints have a much longer thermal fatigue life than the 63Sn–37Pb solder. The 63Sn–37Pb solder joints seem to perform slightly better than the lead‐free solder under mechanical loading.

Keywords

Citation

Ricky Lee, S., Hoi Wai Lui, B., Kong, Y.H., Baylon, B., Leung, T., Umali, P. and Agtarap, H. (2002), "Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders", Soldering & Surface Mount Technology, Vol. 14 No. 3, pp. 46-50. https://doi.org/10.1108/09540910210444728

Publisher

:

MCB UP Ltd

Copyright © 2002, MCB UP Limited

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