Fatigue crack growth behaviour of lead‐containing and lead‐free solders

Abstract

Fatigue crack growth (FCG) tests on lead‐containing solders and lead‐free solders have been carried out at frequencies ranging from 0.01 to 10 Hz and stress ratios in the range 0.1–0.7. The FCG resistance of lead‐free solders was found to be superior to that of lead‐containing solders. For both types of solder, cycle dependent behaviour is dominant for the tests at low stress ratios and high frequencies, while time‐dependent effects become important at high stress ratios and low frequencies. For cycle dependent testing conditions, cracks primarily propagated in a transgranular manner, while a mixed trans/intergranular mode of crack propagation was observed for testing conditions where time dependent effects were dominant. The propagation path of intergranular cracks depended on the test materials, and along interfaces. After the FCG tests, the formation of small grains was observed.

Citation

Mutoh, Y., Zhao, J., Miyashita, Y. and Kanchanomai, C. (2002), "Fatigue crack growth behaviour of lead‐containing and lead‐free solders", Soldering & Surface Mount Technology, Vol. 14 No. 3, pp. 37-45. https://doi.org/10.1108/09540910210444719