Optimisation modelling for flip‐chip solder joint reliability
Abstract
This paper details and demonstrates integrated optimisation‐reliability modelling for predicting the performance of solder joints in electronic packaging. This integrated modelling approach is used to identify efficiently and quickly the most suitable design parameters for solder joint performance during thermal cycling and is demonstrated on flip‐chip components using “no‐flow” underfills. To implement “optimisation in reliability” approach, the finite element simulation tool – PHYSICA, is coupled with optimisation and statistical tools. This resulting framework is capable of performing design optimisation procedures in an entirely automated and systematic manner.
Keywords
Citation
Stoyanov, S., Bailey, C. and Cross, M. (2002), "Optimisation modelling for flip‐chip solder joint reliability", Soldering & Surface Mount Technology, Vol. 14 No. 1, pp. 49-58. https://doi.org/10.1108/09540910210416477
Publisher
:MCB UP Ltd
Copyright © 2002, MCB UP Limited