The paper seeks to present a methodology of computer simulation of coupled magneto‐thermo‐mechanical processes in various electrical engineering devices. The methodology allows determining their parameters, characteristics and behaviour in various operation regimes.
The mathematical model consisting of three equations describing magnetic field, temperature field and field of mechanical strains and stresses (or thermoelastic displacements) is solved numerically, partially in the hard‐coupled formulation.
The methodology seems to be sufficiently robust, reliable and applicable to a wide spectrum of devices.
At this stage of research, the hard‐coupled formulation of thermo‐mechanical (or thermoelastic) problems is still possible only in 2D.
The methodology can successfully be used for design of numerous machines, apparatus and devices from the area of low‐frequency electrical engineering ranging from small actuators to large synchronous generators.
Complete numerical analysis of coupled magneto‐thermo‐mechanical phenomena in electrical devices.
Pantelyat, M., Shulzhenko, M., Matyukhin, Y., Gontarowskiy, P., Dolezel, I. and Ulrych, B. (2011), "Numerical simulation of electrical engineering devices: Magneto‐thermo‐mechanical coupling", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 30 No. 4, pp. 1189-1204. https://doi.org/10.1108/03321641111133127
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