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Optimal design of induction heating equipment for high‐speed processing of a semiconductor

Yoshifumi Okamoto (Department of Electrical and Electronic Engineering, Okayama University, Okayama, Japan)
Toshio Imai (Department of Electrical and Electronic Engineering, Okayama University, Okayama, Japan)
Daisuke Miyagi (Department of Electrical and Electronic Engineering, Okayama University, Okayama, Japan)
Norio Takahashi (Department of Electrical and Electronic Engineering, Okayama University, Okayama, Japan)
Kazuhiro Ozaki (Mitsui Engineering & Shipbuilding Co., Ltd)
Hiroshi Ono (Mitsui Engineering & Shipbuilding Co., Ltd)
Naoki Uchida (Mitsui Engineering & Shipbuilding Co., Ltd)

Abstract

Induction heating is widely used in the industry due to high efficiency, precise control, rapid heating and low pollution properties. To process a semiconductor of high quality, uniform heating is necessary, but it is not easy to heat uniformly by using the conventional induction heating equipment. For this purpose, the zone control induction heating equipment is jointly developed with Mitsui Engineering Shipbuilding Co., Ltd. In this paper, the optimization of current in each coil is carried out using the finite element method and the optimization method in order to obtain a uniform eddy current loss distribution on graphite.

Keywords

Citation

Okamoto, Y., Imai, T., Miyagi, D., Takahashi, N., Ozaki, K., Ono, H. and Uchida, N. (2004), "Optimal design of induction heating equipment for high‐speed processing of a semiconductor", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 23 No. 4, pp. 1045-1052. https://doi.org/10.1108/03321640410553472

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited