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In situ temperature measurements of PQFPs during infrared reflow

M. Dube (CALCE Electronic Products and Systems Center, University of Maryland, Maryland, USA)
T.J. Dishongh (CALCE Electronic Products and Systems Center, University of Maryland, Maryland, USA)
K.E. Beatty (CALCE Electronic Products and Systems Center, University of Maryland, Maryland, USA)
M. Pecht (CALCE Electronic Products and Systems Center, University of Maryland, Maryland, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 1998

157

Abstract

Temperature measurements using thermocouples are made at several locations on J‐leaded plastic quad‐flat packs and printed wiring boards during the reflow soldering process. Both moisture saturated and dry packages are studied, with little difference found in the measured temperature on the package surfaces. The temperature at the component lead is found to be a good approximation to the temperatures observed near the die. This provides an externally measurable parameter to assess delamination and popcorning.

Keywords

Citation

Dube, M., Dishongh, T.J., Beatty, K.E. and Pecht, M. (1998), "In situ temperature measurements of PQFPs during infrared reflow", Circuit World, Vol. 24 No. 4, pp. 29-32. https://doi.org/10.1108/03056129810223945

Publisher

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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