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Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder

Joseph Fjelstad (Verdant Electronics, Sunnyvale, California, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 2013




The purpose of this paper is to describe a novel method for the manufacture of aluminum rigid‐flex circuit assemblies without the use of solder.


The approach involves the use of an aluminum base material and the embedding of components, while avoiding the use of solder in the assembly process.


The new methods and proposed structures address the key manufacturing problems that have vexed users for many years, while simultaneously addressing the challenge of thermal management. They also offer the advantage of enhanced reliability by avoiding the need for high temperatures used in soldering.

Research limitations/implications

While examples of the process and its benefits have been demonstrated, further work is ongoing to expand applicability.


The paper begins with an overview of previous work in this area and then moves on to what is currently being implemented via the new technology. A novel method is described for the creation of potentially more cost‐effective and reliable rigid flex assemblies, which would be suitable for use in a wide range of products, from consumer to high‐reliability automotive, military and aerospace.



Fjelstad, J. (2013), "Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder", Circuit World, Vol. 39 No. 1, pp. 4-8.



Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited

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