High‐performance substrate based on a highly filled thermoplastic polymer

Thomas Apeldorn (Polymer Engineering Department, Universität Bayreuth, Hamburg, Germany)
F. Wolff‐Fabris (Polymer Engineering Department, University of Bayreuth, Bayreuth, Germany)
V. Altstädt (Polymer Engineering Department, University of Bayreuth, Bayreuth, Germany)

Circuit World

ISSN: 0305-6120

Publication date: 8 February 2011

Abstract

Purpose

The purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so‐called LuVo Board) for high‐frequency applications.

Design/methodology/approach

The thermal, mechanical and electrical properties of a new thermoplastic substrate are investigated and compared to conventional substrates for printed circuit board (PCB) applications.

Findings

The new LuVo Board exhibits similar properties to commercially available high‐performance substrates. The main advantage of the LuVo Board is a reduction of manufacturing costs in comparison to conventional substrates, as a highly automated manufacturing process can be employed. Moreover, the LuVo Board exhibits some further advantages: the material is inherently flame resistant and can be thermally shaped after the assembly process.

Originality/value

This paper presents an entirely new thermoplastic substrate, which can be employed in high‐frequency applications. In comparison to standard materials, a further advantage of the thermoplastic substrate is lower production costs.

Keywords

Citation

Apeldorn, T., Wolff‐Fabris, F. and Altstädt, V. (2011), "High‐performance substrate based on a highly filled thermoplastic polymer", Circuit World, Vol. 37 No. 1, pp. 4-14. https://doi.org/10.1108/03056121111101232

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited

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