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This study aims to investigate the performance of filament-based material extrusion additive manufacturing (MEX), combined with debinding and sintering, as a novel approach to manufacturing ceramic components.

A commercial ZrO₂ filament was selected and analysed by infra-red (IR) spectroscopy, rheology and thermo-gravimetry. The influence of the print parameters (layer thickness, flow rate multiplier, printing speed) and sintering cycle were investigated to define a suitable printing and sintering strategy. Biaxial flexure tests were applied on sintered discs realised with optimised printing strategies, and the results were analysed via Weibull statistics to evaluate the mechanical properties of printed components. The hardness and thermal conductivity of sintered components were also tested.

Layer thickness and flow rate multiplier of the printing process were proved to have significant effect on the density of as-printed parts. Optimised samples display a sintered density >99% of the theoretical density, 20% linear sintering shrinkage, a characteristic flexural strength of 871 MPa with a Weibull modulus of 4.9, a Vickers hardness of 12.90 ± 0.3 GPa and a thermal conductivity of 3.62 W/mK. Gyroids were printed for demonstration purposes.

To the best of the authors’ knowledge, this work is the first to apply biaxial flexure tests and Weibull statistics to additively manufactured MEX zirconia components, hence providing comparable results to other additive technologies. Moreover, fractography analysis builds the connection between printing defects and the fracture mechanism of bending. This study also provides guidelines for fabricating high-density zirconia components with MEX.

This paper aims to solve the problems molybdenum disulfide (MoS₂) nanosheets suffer from inadequate dispersion stability and form a weak lubricating film on the friction surface, which severely limits their application as lubricant additives.

MoS₂/C₆₀ nanocomposites were prepared by synthesizing molybdenum disulfide (MoS₂) nanosheets on the surface of hydrochloric acid-activated fullerenes (C₆₀) by in situ hydrothermal method. The composition, structure and morphology of MoS₂/C₆₀ nanocomposites were characterized. Through the high-frequency reciprocating tribology test, its potential as a lubricant additive was evaluated.

MoS₂/C₆₀ nanocomposites that were prepared showed good dispersion in dioctyl sebacate (DOS). When 0.5 Wt.% MoS₂/C₆₀ was added, the friction reduction performance and wear resistance improved by 54.5% and 62.7%, respectively.

MoS₂/C₆₀ composite nanoparticles were prepared by in-situ formation of MoS₂ nanosheets on the surface of C₆₀ activated by HCl through hydrothermal method and were used as potential lubricating oil additives.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-10-2023-0321/

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.