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Article
Publication date: 21 October 2013

Shih-Chieh Fang, Chen-Wei Yang and Wen-Yen Hsu

The main purposes of this study are to develop a knowledge governance mechanism-fit-barrier matrix mode to resolve transfer problems resulting from knowledge characteristics and

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Abstract

Purpose

The main purposes of this study are to develop a knowledge governance mechanism-fit-barrier matrix mode to resolve transfer problems resulting from knowledge characteristics and to clarify the relationship among knowledge characteristics, barriers of knowledge transfer, and effective knowledge transfer in inter-organizational contexts.

Design/methodology/approach

The vast literature on knowledge transfer in inter-organizational context has been reviewed. Moreover, to develop a theoretical framework, the authors developed a set of arguments based on literature pertaining to the knowledge-based view of knowledge characteristics and barriers and the response of network to inter-organizational knowledge transfer.

Findings

Knowledge-based view of knowledge characteristics and barriers and knowledge governance may provide a new understanding for network organizations seeking effective knowledge transfer strategies in inter-organizational context.

Research limitations/implications

The main contribution to organizational theory is extending information-processing theory to form a new strategic model for inter-organizational knowledge transfer.

Practical implications

The fit model of governance mechanisms may help managers to make effective strategies for inter-organizational knowledge transfer.

Originality/value

Theoretically, this paper extends Information Processing Theory to inter-organizational relationships research. The developed model here also helps to explain the importance of cognitive dimensions for successful inter-organizational knowledge transfer. In KM practice, the proposed well-developed strategic models may help managers to link inter-organizational knowledge transfer processes to business strategy, and validate of the way to convert the goal of making their network organizations more intelligent into a strategic action.

Content available
Article
Publication date: 4 February 2014

569

Abstract

Details

Journal of Knowledge Management, vol. 18 no. 1
Type: Research Article
ISSN: 1367-3270

Open Access
Article
Publication date: 21 April 2022

Pei-Lun Hsieh, Shang-Yu Yang, Wen-Yen Lin and Tien-Chi Huang

This study explored the students' perception of their adoption and acceptance of virtual learning (VL), the factors affecting the adoption of educational technologies and the…

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Abstract

Purpose

This study explored the students' perception of their adoption and acceptance of virtual learning (VL), the factors affecting the adoption of educational technologies and the correlation between their intention, perceived behavioral control and care competence in caring for older adults.

Design/methodology/approach

A cross-sectional survey was conducted. Surveys were administered to evaluate the participants who were involved in VL on geriatric care during coronavirus disease 2019 (COVID-19) pandemic. A total of 315 nursing students participated in the survey, and 287 valid questionnaires were collected (response rate: 91.11%).

Findings

A total of 287 participants (mean age 21.09, SD 1.44 years; 242/287, 84.3% female) were included in the study. The variables of intention to use technologies were positively correlated with care competence (r = 0.59, p < 0.001). The results revealed that the major predictors were perceived ease-of-use (PEOU) (β = 0.28, 95% confidence interval (CI) 0.16–0.40) and perceived usefulness (PU) (β = 0.22, CI 0.09–0.35) which were significantly positive predictors of competence in geriatric care.

Research limitations/implications

Nursing students lack in clinical knowledge and situational experience in geriatric care; therefore, their perceptiveness, expressions and reflection on the process of providing care to hospitalized older patients should be increased. These results indicated that students improved in geriatric healthcare after/during the VL program during COVID-19 pandemic.

Originality/value

It is hoped that the present study would make an invaluable contribution to existing research on education in general and on the quality of care in geriatric nursing as limited studies have been published so far.

Details

Library Hi Tech, vol. 41 no. 1
Type: Research Article
ISSN: 0737-8831

Keywords

Article
Publication date: 19 September 2023

Andromeda Dwi Laksono, Chih-Ming Chen and Yee-Wen Yen

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…

Abstract

Purpose

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

Design/methodology/approach

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

Findings

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

Originality/value

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

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