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Article
Publication date: 26 July 2013

Wei Chiat Leong, Mohd Zulkifly Abdullah, Chu Yee Khor and Dadan Ramdan

The flexible printed circuit board (FPCB) can be an alternative to the rigid printed circuit board because of its excellent flexibility, twistability, and light weight. Using FPCB…

Abstract

Purpose

The flexible printed circuit board (FPCB) can be an alternative to the rigid printed circuit board because of its excellent flexibility, twistability, and light weight. Using FPCB to construct personal computer (PC) motherboard is still rare. Therefore, the present study aims to investigate the fluid‐structure interaction (FSI) behaviors of the newly proposed FPCB motherboard under fan‐flow condition in the PC casings.

Design/methodology/approach

The deflection and stress induced, which are usually ignored in the traditional rigid motherboard, are the main concern in the current FPCB motherboard studies. Only a few studies have been conducted on the effect of inlet locations, effect of inlet sizes, effect of multi‐inlets, and effect of a two‐fan system. These numerical analyses are performed using the fluid flow solver FLUENT and the structural solver ABAQUS; they are real‐time online coupled by Mesh‐based Parallel Code Coupling Interface (MpCCI).

Findings

A smaller inlet size can cause higher deflection and stress fluctuations, but the fluctuations can be reduced by incorporating the multi‐inlets design. In addition, the inlet locations and two‐fan system can prominently affect the magnitudes of the deflection and stress induced.

Practical implications

The current study provides better understanding and allows designers to be aware of the FSI phenomenon when dealing with the FPCB motherboard. Although the present study primarily focuses on the motherboard, the findings could also contribute valuable information for other FPCB applications.

Originality/value

The present study extends the FSI investigation from the previous novel approach of FPCB motherboard, and uniquely explores the behaviors of the FPCB motherboard inside different PC casings.

Details

Microelectronics International, vol. 30 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 20 July 2021

David Ocón

The paper aims to provide up-to-date analysis on how a country like Singapore, with a rich tangible and intangible cultural heritage associated with burial customs, approaches…

Abstract

Purpose

The paper aims to provide up-to-date analysis on how a country like Singapore, with a rich tangible and intangible cultural heritage associated with burial customs, approaches heritage preservation while ensuring modernisation and sustainable growth.

Design/methodology/approach

The paper is an exploratory analysis of the association between cultural heritage preservation, particularly the one associated with elaborate burials, and the need for modernisation in Singapore. It mainly uses desk research tools, fieldwork and interviews with death services providers to build a set of conclusions. It employs a historical review approach and uses comparative analyses with other countries in the Asian region to substantiate the arguments.

Findings

The paper provides insights about how, since its independence, Singapore has switched to pragmatic models of growth and development which imply maximising the limited space available, often at the cost of precious cultural heritage. The rapid development has had a significant impact on the country's burial customs and legacies, particularly on elaborate graves and tombs, which traditionally use a considerable amount of space. The analysis concludes that Singapore is in the constant challenge of exploring alternative ways of handling death and its ramifications.

Originality/value

This paper presents a new outlook on the relationship between the preservation of the tangible and intangible cultural heritage associated with death practices and a sustainable approach to modernisation in the context of Singapore.

Details

Journal of Cultural Heritage Management and Sustainable Development, vol. 13 no. 1
Type: Research Article
ISSN: 2044-1266

Keywords

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