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Article
Publication date: 30 April 2024

Fang Liu, Zilong Wang, JiaCheng Zhou, Yuqin Wu and Zhen Wang

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects…

Abstract

Purpose

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

Design/methodology/approach

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

Findings

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

Originality/value

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 12 April 2024

Ravikantha Prabhu, Sharun Mendonca, Pavana Kumara Bellairu, Rudolf D'Souza and Thirumaleshwara Bhat

This study explores how titanium oxide (TiO2) filler influences the specific wear rate (SWR) in flax fiber-reinforced epoxy composites (FFRCs) through a Taguchi approach. It aims…

Abstract

Purpose

This study explores how titanium oxide (TiO2) filler influences the specific wear rate (SWR) in flax fiber-reinforced epoxy composites (FFRCs) through a Taguchi approach. It aims to boost abrasive wear resistance by incorporating TiO2 filler, promoting sustainable and eco-friendly materials.

Design/methodology/approach

This study fabricates epoxy/flax composites with TiO2 particles (0–8 wt%) using hand layup. Composites were tested for wear following American Society for Testing and Materials (ASTM) G99-05. Statistical analysis used Taguchi design of experiments (DOE), with ANOVA identifying key factors affecting SWR in abrasive sliding conditions.

Findings

The study illuminates how integrating TiO2 filler particles into epoxy/flax composites enhances abrasive wear properties. Statistical analysis of SWR highlights abrasive grit size (grit) as the most influential factor, followed by normal load, wt% of TiO2 and sliding distance. Grit size has the highest effect at 43.78%, and wt% TiO2 filler contributes 15.61% to SWR according to ANOVA. Notably, the Taguchi predictive model closely aligns with experimental results, validating its reliability.

Originality/value

This paper integrates TiO2 filler and flax fibers to form a novel hybrid composite with enhanced tribological properties in epoxy composites. The use of Taguchi DOE and ANOVA offers valuable insights for optimizing control variables, particularly in natural fiber-reinforced composites (NFRCs).

Details

Multidiscipline Modeling in Materials and Structures, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1573-6105

Keywords

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