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There are often relational interactions in teams that lead to and drive the spread of work engagement. Despite the potential social impacts on work engagement, such as coworker support and organizational citizenship behaviors within teams, they have rarely been studied from a social perspective using social network analysis (SNA). This review draws on the crossover model and conservation of resources theory to suggest that the effects of social diffusion and the exchange of resources can impact Well-Being, specifically work engagement, in teams and that SNA can help measure those social interactions. Linking several network concepts – closeness centrality, density, degree centrality, and tie strength – to work engagement propositions related to the spread of work engagement as well as the number and quality of network ties, this review elucidates the potential for integrating SNA methodology to the field of Well-Being for teams.

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.