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The purpose of this paper is to investigate the electronic industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

This work achieves its objective by discussing the various international regulations pertaining to electronics manufacturing and relating the industry reactions to those regulations. The electronics industry is pursuing lead‐free solders and halogen‐free FRs, in part due to regulations. However, the paper includes examples of how the industry is successful in implementing environmentally friendly changes.

The authors compared regulations from Japan, the European Union, and the US. While the regulations themselves vary in scope, industry actions to find alternatives do have common purposes. Electronics manufacturers recognize that environmentally motivated changes are beneficial in terms of waste minimization. Regardless of the regulatory motivation, minimization does lead to energy and economic efficiency.

Electronics manufacturers that are interested in green design will benefit from understanding present regulations. They will also benefit from the included examples of product and process improvement for the purpose of environmental compatibility. The paper includes specific examples of material alternatives to banned substances.

This paper derives its perspective from a similar review of literature and company findings that the authors completed in 2001. As refinement of the regulations has continued, the electronics industry has developed improvements in basic materials and processes.

This paper seeks to investigate the electronics industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

This work achieves its objective by discussing the various international environmental regulations pertaining to electronics manufacturing and relating the industry reactions to those regulations. It also provides the market trends related to lead‐ and halogen‐free products. The electronics industry is pursuing lead‐free solders and halogen‐free FRs, in part due to regulations. However, the paper includes examples of how the industry is successful in implementing environmentally friendly changes.

The authors compared regulations from Japan, the European Union, the USA, and China. While the regulations themselves vary in scope, industry actions to find alternatives do have common purposes. Electronics manufacturers recognize that environmentally motivated changes are beneficial in terms of waste minimization.

Electronics manufacturers that are interested in green design will benefit from understanding present regulations. They will also benefit from the included examples of product and process improvement for the purpose of environmental compatibility.

This paper derives its perspective from a similar review of literature and company findings that the authors completed in 2006. As refinement of the regulations has continued, the electronics industry has developed improvements in basic materials and processes.

The purpose of this paper is to characterize the motivations used into migrating to lead‐free solder by providing examples and directions for those making the material change.

This work achieves its objective of identifying which electronic industry actions towards lead‐free soldering have been successful and why. The research reported the various motivating factors considered in adopting lead‐free electronics. To that end, the authors researched industry literature and discussed approaches with various companies and agencies. The scope of this paper is largely the board‐component level soldering process and companies involved in the international electronics industry.

The motivation to migrate to lead‐free solder has been and continues to be multi‐faceted. Issues include regulatory, commercial, and technical. Processing with lead‐free solder is successful, so the electronics industry's move towards environmentally compatible processes will meet regulated dates for change.

A company can learn how to incorporate environmental improvement principles resulting from the migration to lead‐free solder. Using that migration as a case study, the company can realize additional benefits by applying these principles to other product lines. Those interested in developing environmentally friendly products and processes can adopt the lessons that this paper identifies. Incorporation of lead‐free techniques, rather than resistance to change, is the result of adopting the lessons.

The paper presents a synopsis of the electronic industry's migration to lead‐free products and processes. It compares motivations for change that other studies have not compared. Manufacturers searching for direction and example to meet waste minimization goals will find the paper useful in providing such.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment.

The International Electronic Components Show in Paris in November, 1983, provided the occasion for a very successful meeting of ISHM‐France which attracted 170 attendees. The following presentations were given:

This report, presented as the keynote paper at Surface Mount International, is the culmination of joint efforts to assess the use of lead in electronics assembly. The study, which will be presented in two parts, involved the collaboration of the following participants: B. R. Allenby and J. P. Ciccarelli, AT&T, Basking Ridge, New Jersey; I. Artaki, J. R. Fisher and D. Schoenthaler, AT&T Bell Laboratories, ERC, Princeton, New Jersey; T. A. Carroll, Hughes, El Segundo, California; D. W. Dahringer, Y. Degani, R. S. Freund, T. E. Graedel, A. M. Lyons and J. T. Plewes, AT&T Bell Laboratories, Murray Hill, New Jersey; C. Gherman and H. Solomon, GE Aerospace, Philadelphia, Pennsylvania; C. Melton, Motorola Inc., Schaumburg, Illinois; G. C. Munie, AT&T Bell Laboratories, Indian Hill, Naperville, Illinois; and N. Socolowski, Alpha Metals, Jersey City, New Jersey.

Concern over global environmental pollution has resulted in a raft of new legislation, a major impact of which has been fundamental re‐evaluation of processing technologies used within the electronics manufacturing industry. Although compliance remains a key driver for change, other factors (e.g., market, social, new business opportunities) are also providing significant pressures. Assessments of how to control pollution have led to a much deeper appreciation of how to manage this dramatic impact on the industry. In the short‐term, the key is dealing with emissions from current premises and processes. But in the longer‐term, improvements are only possible by designing products to minimise the whole‐life environmental impact (e.g., avoiding hazardous materials, minimising waste, designing for re‐use and recycling). Crucial to the success of both short‐term and long‐term activities are the motivation and co‐operation of the workforce, together with the commitment and support of management. This paper examines some of the pressures on the industry, highlights several of the resultant technical and management challenges, and briefly outlines how one company is successfully addressing these challenges.

Tin‐lead solder has been the primary method for connecting electronic components to printed circuit boards since near the time of its inception. Over the last 60 years, solder has proven a viable assembly method over that time and there is a deep understanding of the technology won over years of practice. However, the European Union has banned the use of lead in electronic solder, based on the misguided assumption that lead in electronic solder represented a risk to human health. Aims to describe a new approach to manufacturing electronic assemblies without the use of solder.

The paper discusses how the new era of lead‐free solder has resulted in a host of new problems for the electronics industry, many of which had not been experienced when elemental lead was included in the solder alloy.

Electronics assembly technology literature is rife with articles and papers citing the problems or challenges of lead‐free assembly and proposing new or improved solutions or investigative tool to better unearth the problems of lead‐free. The new process has come to be known as the Occam process, named to honor the fourteenth century English philosopher and logician, William of Occam, whose rigorous thinking and arguments in favor of finding the simplest possible solution served as the inspiration and catalyst for the new approach.

The paper describes a new approach to manufacturing electronic assemblies without the use of solder.

Increasing awareness of man's impact on the environment and pressure to behave in a more sustainable manner are encouraging both the recycling and reuse of materials and the replacement of hazardous chemicals with more benign ones. The Waste Electrical and Electronic Equipment (WEEE) Directive and the Restriction on the use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive, have recently been adopted into law with the specific intention of further encouraging these activities through legislation. In addition to these directives, there is a growing need to adopt sound design principles so that new products are created in a more environmentally acceptable way and that their environmental impact throughout their lifecycles is minimised. This paper gives an overview of this new European legislation and discusses its impact on the electronics industry. The potential benefits of adopting such an approach are outlined.