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Article
Publication date: 10 May 2013

John Ling

170

Abstract

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Circuit World, vol. 39 no. 2
Type: Research Article
ISSN: 0305-6120

Abstract

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Soldering & Surface Mount Technology, vol. 21 no. 4
Type: Research Article
ISSN: 0954-0911

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126

Abstract

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Microelectronics International, vol. 27 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 7 August 2017

Agata Skwarek

283

Abstract

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Microelectronics International, vol. 34 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 3 August 2015

Agata Skwarek

257

Abstract

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Circuit World, vol. 41 no. 3
Type: Research Article
ISSN: 0305-6120

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Book part
Publication date: 1 January 2008

Abstract

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Advances in Ecopolitics
Type: Book
ISBN: 978-1-78052-669-0

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Book part
Publication date: 1 January 2009

Abstract

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Special Edition: Financial Crisis - Environmental Crisis: What is the Link?
Type: Book
ISBN: 978-1-78052-670-6

Open Access
Article
Publication date: 15 May 2023

Yin Ying Cai, Jin Xie and Lynn Huntsinger

Faced with the challenges of rural population decline, combined with the widespread expansion of homesteads in rural areas, local Chinese governments hope to strictly control and…

61440

Abstract

Purpose

Faced with the challenges of rural population decline, combined with the widespread expansion of homesteads in rural areas, local Chinese governments hope to strictly control and minimize rural housing land. Accurately decomposing the process of rural housing expansion and revealing its driving factors will be helpful for land-use regulation by the government.

Design/methodology/approach

In this study, an unusually rich dataset of rural housing registration from Pudong New Area in Shanghai is employed. The study aimed to decompose the fragmented accumulation process and its expansion determinants on rural housing assets. The dataset covers all samples of rural households and housing plots at 72 surveyed villages in six towns.

Findings

Housing offers profitable capital and earning assets to villagers at the urban fringe, so they have a powerful incentive to build and expand more. The results of this analysis showed that the expansion of rural housing is largely due to the haphazard construction of auxiliary rooms by villagers, especially on plots of arable land that are adjacent to their houses that have been stealthily converted into auxiliary rooms and sheds. Low costs and weak penalties have led to an increase in rent-seeking expansions to rural houses. Houses with the smaller initial areas, families with more laborers and household heads, and the proximity of villages to downtown with convenient living services were the main driving factors for expanding houses. A concerted effort is needed to control the disorganized and unlicensed expansion of housing. This effort should include formulating areas for free use by villagers, high taxes on overused areas, serious penalties for unlicensed housing expansion and effective land-use planning.

Research limitations/implications

An understanding of the expansion status and control measures related to rural houses in Shanghai provides an important reference that can help to guide the formulation of rural housing policies, and the sustainable development of cities worldwide. Of course, this study cannot generalize about housing distribution and expansion status worldwide based on the study area in China, because China's land tenure policies are unique. But land registry data exists that makes research like this feasible. There is a need to carefully examine the detailed housing distribution in each country before it can be decided on how best to address the disorderly increase in rural housing stock, and promote the reduction of rural residential expansion.

Originality/value

First, the process of rural housing expansion by using an unique dataset which covers ten thousands of samples is revealed. Second, the results have policy implications for reducing the amount of idle and inefficiently rural homestead. The focus is on rural housing growth and its driving factors in Shanghai, and the villagers' motivations for housing expansion are explored.

Details

China Agricultural Economic Review, vol. 15 no. 3
Type: Research Article
ISSN: 1756-137X

Keywords

Open Access
Article
Publication date: 19 January 2023

Haijuan Yang, Gail Krantzberg, Xiaohuan Dong and Xiwu Hu

This study aims to examine the impact of migration growth on environmental outcomes and local governance and assess how well the existing local municipal governance has responded…

1117

Abstract

Purpose

This study aims to examine the impact of migration growth on environmental outcomes and local governance and assess how well the existing local municipal governance has responded to the environmental impact of increased migration influx in Ontario, Canada using the annual data during 2012–2021.

Design/methodology/approach

This study used the grey relational analysis (GRA) to examine the correlation degree between migrant growth, environmental outcomes and local governance, used coupling coordination degree model (CCDM) to access to what extent the existing local governance systems have responded to the environmental impact of immigrant growth.

Findings

Results show that higher immigrant populations are associated with worse environmental outcomes and the need for more municipal environmental investment and service. The present local municipal environmental service in Ontario lags behind in response to the environmental impacts of increased migration. Good local governance practices and environmental services are required to improve the environmental adaptation capacity of host countries to migrant influx.

Originality/value

Climate change has been regarded as an important driver of internal and international human migration. The mass influxes of migrants will threaten cities’ environmental quality and put considerable pressure on municipal services. This study provides empirical evidence for Ontario’s municipal environmental governance and relevant authorities on how to deal with the environmental impact of increased migration and contributes to call the attention of other countries to the urban environmental pressure caused by migration influx due to the changing climate world wide.

Details

International Journal of Climate Change Strategies and Management, vol. 15 no. 3
Type: Research Article
ISSN: 1756-8692

Keywords

Open Access
Article
Publication date: 13 October 2022

Marcin Myśliwiec, Ryszard Kisiel and Mirosław J. Kruszewski

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties…

Abstract

Purpose

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Design/methodology/approach

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

Findings

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

Originality/value

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

Details

Microelectronics International, vol. 39 no. 4
Type: Research Article
ISSN: 1356-5362

Keywords

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